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The Cooling Problem That Could Bottleneck AI

The Cooling Problem That Could Bottleneck AI

A South Korean startup, KoolMicro, is betting that liquid cooling built into the chip package itself is the only way to handle the next generation of GPU heat loads.


News May 20, 2026 by Gordon Feller
The Hidden Cooling Bottleneck Inside Liquid-Cooled AI Data Centers

The Hidden Cooling Bottleneck Inside Liquid-Cooled AI Data Centers

Learn how liquid cooling eliminates system airflow, creating a hidden thermal bottleneck for 'left-behind' components like memory and SSDs. Targeted micro-cooling is required to restore system balance.


Thermal Research Roundup: New Ways to Store, Move, and Control Heat

Thermal Research Roundup: New Ways to Store, Move, and Control Heat

Researchers are advancing materials and device concepts that treat heat as something that can be stored, directed, or actively managed, rather than merely dissipated.


News Feb 11, 2026 by Luke James
Breaking the Thermal Wall Using Monolithic Ceramic Cooling for Power Electronics

Breaking the Thermal Wall Using Monolithic Ceramic Cooling for Power Electronics

Learn how monolithic ceramic cooling using Selective Laser Reaction Sintering (SLRS) eliminates the "thermal wall" in high-density power electronics by creating single-piece, reliable heat exchangers.


Allegro Targets Noise and Heat With SiC Gate Drivers, Sensors

Allegro Targets Noise and Heat With SiC Gate Drivers, Sensors

The silicon carbide gate drivers and an ultra-low-loss isolated current sensor can improve efficiency and power density in high-voltage systems.


News Jan 23, 2026 by Joshua Tidwell
 Amphenol LTW SnapQD Connectors | New Product Brief

Amphenol LTW SnapQD Connectors | New Product Brief

Amphenol LTW SnapQD Connectors provide a high-flow, leak-free cooling solution designed for durability and ease of use in demanding environments. Watch and learn all about their features, specs, applications, and more!


Our Top 2025 Research Stories: Rubber CMOS, Washable Electronics, and More

Our Top 2025 Research Stories: Rubber CMOS, Washable Electronics, and More

Enjoy this roundup of our favorite All About Circuits research news articles of 2025!


News Dec 26, 2025 by Jeff Child
Upgraded MOSFETs Target Power Density, Safety, and Efficiency

Upgraded MOSFETs Target Power Density, Safety, and Efficiency

Rohm, Littelfuse, and Ideal Semiconductor each introduced high-performance MOSFETs.


News Dec 11, 2025 by Jake Hertz
TE Connectivity VOLINSU Electric Vehicle Busbar (EVBB) Heat Shrink Tubings | New Product Brief

TE Connectivity VOLINSU Electric Vehicle Busbar (EVBB) Heat Shrink Tubings | New Product Brief

TE Connectivity VOLINSU Electric Vehicle Busbar (EVBB) Heat Shrink Tubings provide durable, flame-retardant, high-voltage insulation for electric vehicle and industrial power systems. Watch and learn all about their features, specs, applications, and more!


Optimizing Thermal Management with Same Sky AC Axial Fans | Tech Guide

Optimizing Thermal Management with Same Sky AC Axial Fans | Tech Guide

In this Tech Guide, we dive into Same Sky’s AC Axial Fans—compact yet powerful solutions for effective thermal management in industrial, commercial, and electronic systems. Watch now to get started!


Intel and Shell Team Up on Immersion Cooling in Xeon-Based Data Centers

Intel and Shell Team Up on Immersion Cooling in Xeon-Based Data Centers

Intel and Shell have partnered to deliver the first Intel-certified immersion cooling solution for Xeon processors, addressing rising AI data center demands.


News May 20, 2025 by Luke James
Texas Instruments DRV832x 3-Phase Smart Gate Drivers | New Product Brief

Texas Instruments DRV832x 3-Phase Smart Gate Drivers | New Product Brief

Texas Instruments DRV832x 3-Phase Smart Gate Drivers deliver high-performance control for motor applications by driving high-side and low-side N-channel MOSFETs. Watch and learn all about their features, specs, applications, and more!


Edge AI Meets Next-Gen Cooling: The Breakthrough of Silicon-Based Micro-Cooling Fans

Edge AI Meets Next-Gen Cooling: The Breakthrough of Silicon-Based Micro-Cooling Fans

MEMS-based miniature-fan technology can provide improved thermal performance, increased reliability, and reduced noise for advanced processors.


A Deep Dive on Winbond’s Memory Technology for Edge AI

A Deep Dive on Winbond’s Memory Technology for Edge AI

In this deep dive, we take a look at how Winbond’s CUBE technology solves memory challenges for edge AI designs.


News Nov 13, 2024 by Jeff Child
High-Power PCB Relay Keeps EV Charging Cool

High-Power PCB Relay Keeps EV Charging Cool

Omron’s 4-pole relay fits on a PCB to reduce the heat generated in three-phase power electric vehicle wallboxes during high-power charging.


News Sep 05, 2024 by Liam Critchley
Crafting a Silicon Lifecycle Management Strategy for HPC and Data Centers

Crafting a Silicon Lifecycle Management Strategy for HPC and Data Centers

As data center computing and HPC advances, the stakes for ensuring reliability are high. Learn how to develop a silicon lifecycle management (SLM) strategy that ensures a successful future for your designs.


Sanyo Denki San Ace 40L 9LG High Static Pressure Long Life Fans | New Product Brief

Sanyo Denki San Ace 40L 9LG High Static Pressure Long Life Fans | New Product Brief

Sanyo Denki San Ace 40L 9LG High Static Pressure Long Life Fans are designed for demanding applications, offering a maximum static pressure of 1780 Pascals and high airflow. Watch and learn all about their features, specs, applications, and more!


SureCore Balances Power and Cooling Costs With Cryogenic Memory

SureCore Balances Power and Cooling Costs With Cryogenic Memory

SureCore has announced a low-power, cryogenic SRAM to reduce the energy demands of AI workloads on data centers.


News Jun 11, 2024 by Arjun Nijhawan
Onsemi Intros 7th Gen IGBT-based Intelligent Power Modules

Onsemi Intros 7th Gen IGBT-based Intelligent Power Modules

Announced today at APEC 2024, the new, highly integrated family of devices, reduces package size and increases power density for designers.


News Feb 26, 2024 by Jake Hertz
Quantum Computing: Sci-Fi Technology Requires Real-World Engineering

Quantum Computing: Sci-Fi Technology Requires Real-World Engineering

As CTO of IBM Quantum, Oliver Dial leads the development of the world’s most advanced quantum computers. He discusses the challenges of building quantum ICs, operating them at cryogenic temperatures, the future of quantum computing, and more.