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Breaking AI Bottlenecks: 3 Startups Look Beyond the Chip

Breaking AI Bottlenecks: 3 Startups Look Beyond the Chip

Lotus Microsystems, Oriole Networks, and Atomera have each rolled out technologies tackling the physical limits slowing AI infrastructure.


News Jun 18, 2026 by Luke James
Microchip Releases Data Center Retimers for High‑Bandwidth Architectures

Microchip Releases Data Center Retimers for High‑Bandwidth Architectures

The new XpressConnect PCIe 6.0 and CXL 3.1 Retimers reign in signal integrity challenges in AI data centers and other high-bandwidth installations.


News Jun 15, 2026 by Duane Benson
Rambus Rolls Out Memory Chipset to Unburden AI PCs

Rambus Rolls Out Memory Chipset to Unburden AI PCs

The new chipset targets CUDIMM, CQDIMM, and CSODIMM modules for AI PC desktops and laptops.


News Jun 15, 2026 by Jake Hertz
Onsemi Unveils Interactive Web Tool to Simplify Power Design

Onsemi Unveils Interactive Web Tool to Simplify Power Design

The new Elite Pairing Studio is an interactive cloud-based simulation tool designed to give power electronics engineers deep visibility into device-level switching behavior and component trade-offs.


News Jun 12, 2026 by Jeff Child
France’s Drive to Rebuild a Native Semiconductor Industry

France’s Drive to Rebuild a Native Semiconductor Industry

France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this ambitious effort, and the market challenges it’s facing.


News Jun 11, 2026 by Gordon Feller
Unlocking the Future of In-Cabin Monitoring With Radar and Camera Fusion

Unlocking the Future of In-Cabin Monitoring With Radar and Camera Fusion

This article explores the advantages of using both radar and camera systems in the cabin of a vehicle. It also gives some ideas as to what all-in-one solutions could look like.


Goodbye Cuff: AI Radar Monitors Heart Health Across the Room

Goodbye Cuff: AI Radar Monitors Heart Health Across the Room

A new prototype tracks pulse transit time at four points on the body using millimeter-wave chirps and neural networks, pointing toward ambient at-home heart monitoring.


News Jun 09, 2026 by Luke James
Siglent Integrates New Arbitrary Waveform Generator With IQ Modulation

Siglent Integrates New Arbitrary Waveform Generator With IQ Modulation

The new SDG8000A series delivers functionality for DC-to-5-GHz signal synthesis for advanced RF and high-speed digital applications.


News Jun 08, 2026 by Duane Benson
Intel Outfits New Xeon Processors, Networking, and GPUs for Agentic AI

Intel Outfits New Xeon Processors, Networking, and GPUs for Agentic AI

At Computex, Intel described the CPU as the control plane for agentic workloads, pairing new processors and network controllers with fresh details on its inference GPU.


News Jun 05, 2026 by Luke James
Nvidia Launches CPU for AI Agents, Claimed as 1.8x Faster Than x86 CPUs

Nvidia Launches CPU for AI Agents, Claimed as 1.8x Faster Than x86 CPUs

The 88-core Vera processor introduces Spatial Multithreading and a claimed 1.8x task-completion lead over x86 processors.


News Jun 04, 2026 by Luke James
Spinning Disks Sputter as AI Heats up Data

Spinning Disks Sputter as AI Heats up Data

AI-driven data demands are outpacing traditional HDDs. System developers must migrate to high-performance, secure, and efficient NVMe SSDs to scale for AI workloads.


Qualcomm Brings Wi-Fi 7 and On-Device AI to Broadband Hardware

Qualcomm Brings Wi-Fi 7 and On-Device AI to Broadband Hardware

The new MBM7 and MBM4 platforms add display, camera, and Hexagon-class AI inference to chips that previously only handled connectivity.


News Jun 03, 2026 by Luke James
Bending Light: How Optics Research Is Rewriting the Rules of Computing

Bending Light: How Optics Research Is Rewriting the Rules of Computing

Recent advances in photonics may boost the performance of LiDAR sensors, increase the resolution of image projection, and integrate energy harvesting and light emission into a single display.


News Jun 02, 2026 by Duane Benson
Siemens Intros AI-Powered Library Characterizer to Speed IC Design

Siemens Intros AI-Powered Library Characterizer to Speed IC Design

New characterization software delivers 7x throughput gains by combining a predictive AI engine with a purpose-built SPICE simulator.


News Jun 02, 2026 by Luke James
Qualcomm Unwraps Products Bringing AI to Entry–Level Laptops and Robotics

Qualcomm Unwraps Products Bringing AI to Entry–Level Laptops and Robotics

At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level laptops, and the Dragonwing IQ10 Reference Design for robotics.


News Jun 01, 2026 by Jeff Child
Light Speed: How Integrated Photonics Is Solving AI’s Interconnect Crisis

Light Speed: How Integrated Photonics Is Solving AI’s Interconnect Crisis

The bottleneck limiting the next generation of artificial intelligence isn't compute power—it's the wire connecting the chips. French startup Scintil Photonics thinks it has the answer.


News May 29, 2026 by Gordon Feller
Enabling High-Performance AI PC Web Cameras Using eUSB2V2 Version of USB

Enabling High-Performance AI PC Web Cameras Using eUSB2V2 Version of USB

Learn how eUSB2V2-based enabling technology for next-generation AI PC web cameras delivers the high bandwidth, local intelligence, and power efficiency required for emerging edge AI use cases.


Broadcom Unveils Integrated Wi-Fi 8- and 50G PON Gateway-ICs for the AI Era

Broadcom Unveils Integrated Wi-Fi 8- and 50G PON Gateway-ICs for the AI Era

Broadcom’s high-integration Wi-Fi 8 & NPU-accelerated 50G PON gateway SoCs aim to build a cohesive, 50 Gbps broadband access ecosystem for the AI-infused home.


News May 27, 2026 by Jeff Child
The Shift to Edge AI Requires Connector Choices to be Re-Examined

The Shift to Edge AI Requires Connector Choices to be Re-Examined

Edge AI moves is moving processing to harsh environments like UAVs and robotics. Connectors must be rugged, compact, and high-power to meet SWaP-C constraints and ensure safety/reliability.


The Cooling Problem That Could Bottleneck AI

The Cooling Problem That Could Bottleneck AI

A South Korean startup, KoolMicro, is betting that liquid cooling built into the chip package itself is the only way to handle the next generation of GPU heat loads.


News May 20, 2026 by Gordon Feller