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Beyond PLL Lock: Rethinking AC Phase Timing Confidence

Beyond PLL Lock: Rethinking AC Phase Timing Confidence

PLL lock doesn't mean your phase timing is trustworthy. Learn why AC synchronization systems need measured, validated phase references—not just loop convergence.


Unlocking the Future of In-Cabin Monitoring With Radar and Camera Fusion

Unlocking the Future of In-Cabin Monitoring With Radar and Camera Fusion

This article explores the advantages of using both radar and camera systems in the cabin of a vehicle. It also gives some ideas as to what all-in-one solutions could look like.


Spinning Disks Sputter as AI Heats up Data

Spinning Disks Sputter as AI Heats up Data

AI-driven data demands are outpacing traditional HDDs. System developers must migrate to high-performance, secure, and efficient NVMe SSDs to scale for AI workloads.


Enabling High-Performance AI PC Web Cameras Using eUSB2V2 Version of USB

Enabling High-Performance AI PC Web Cameras Using eUSB2V2 Version of USB

Learn how eUSB2V2-based enabling technology for next-generation AI PC web cameras delivers the high bandwidth, local intelligence, and power efficiency required for emerging edge AI use cases.


Why Gold-Plated Tactile Switches Matter in Next Gen High-End Electronics

Why Gold-Plated Tactile Switches Matter in Next Gen High-End Electronics

Learn how advanced contact materials improve signal integrity, durability, and lifecycle performance in demanding environments


The Shift to Edge AI Requires Connector Choices to be Re-Examined

The Shift to Edge AI Requires Connector Choices to be Re-Examined

Edge AI moves is moving processing to harsh environments like UAVs and robotics. Connectors must be rugged, compact, and high-power to meet SWaP-C constraints and ensure safety/reliability.


Boost the Power Delivery Potential of USB-C Ports with Protection Switches

Boost the Power Delivery Potential of USB-C Ports with Protection Switches

Learn how innovative technologies like protection switches will be crucial in transitioning to high-power delivery of USB-C ports.


Edge AI Development Is a Lifecycle Problem

Edge AI Development Is a Lifecycle Problem

Edge AI success is limited by memory and power. Fragmented tools cause failures. Learn how a cohesive, full-lifecycle approach unifying design and deployment is essential for scalable systems.


How SoC Integration Impacts SMT Assembly Yield

How SoC Integration Impacts SMT Assembly Yield

Learn how SoC integration impacts SMT assembly yield, from fine-pitch BGA challenges and package warpage to reflow profiling and inspection strategies.


5 V MCUs and 5 V Tolerant MCUs—What’s the Difference and Why It Matters

5 V MCUs and 5 V Tolerant MCUs—What’s the Difference and Why It Matters

5 V microcontrollers vs. 5 V Tolerant microcontrollers: That single word is a massive differentiator. Learn the crucial difference between supply voltage and I/O tolerance for predictable 5 V logic design.


The Hidden Cooling Bottleneck Inside Liquid-Cooled AI Data Centers

The Hidden Cooling Bottleneck Inside Liquid-Cooled AI Data Centers

Learn how liquid cooling eliminates system airflow, creating a hidden thermal bottleneck for 'left-behind' components like memory and SSDs. Targeted micro-cooling is required to restore system balance.


How Neuromorphic Chips are Revolutionizing the Edge

How Neuromorphic Chips are Revolutionizing the Edge

Neuromorphic Edge AI chips mark a fundamental departure from traditional silicon, utilizing brain-inspired, event-driven architectures to enable real-time inference within milliwatt-level power budgets.


HDLs Are Software (and It’s Crazy We’re Still Arguing About It)

HDLs Are Software (and It’s Crazy We’re Still Arguing About It)

HDLs are formal descriptions of behavior, making them software by definition. Modernizing these outdated tools is key to making FPGA development more accessible and productive for all engineers.


SoC Evaluation Boards Evolve to Meet New Design Complexities

SoC Evaluation Boards Evolve to Meet New Design Complexities

Modern SoC Evaluation Boards demand high-performance design, SI/PI, and system validation. Faraday offers 3 flexible service levels to meet these complexities.


Avoid Rework and Production Delays by Aligning Electrical and Mechanical Design

Avoid Rework and Production Delays by Aligning Electrical and Mechanical Design

Learn how to prevent costly assembly delays by synchronizing ECAD and MCAD workflows through continuous 3D validation. This also stabilizes production and eliminates mid-cycle re-spins.


Decisions Ahead for the Next Generation of Advanced Packaging

Decisions Ahead for the Next Generation of Advanced Packaging

Advanced packaging is at a crossroads due to AI demand. Learn the four emerging paths—CoWoS, CoPoS, glass-core, and CoWoP—and how to choose the right one for your multi-die system design.


Designing Ultra-Low-Power Smart Thermostats with Latching Solid-State Relays

Designing Ultra-Low-Power Smart Thermostats with Latching Solid-State Relays

A load-powered relay architecture allows smart HVAC controllers to operate without batteries or a common wire while enabling compact, silent switching.


Proving Reliability in Critical Embedded Systems

Proving Reliability in Critical Embedded Systems

Learn how formal verification uses math to prove the absence of runtime errors in complex embedded software for critical defense/space systems, offering stronger reliability than testing.


Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

The shift to 3D ICs and chiplets demands automated, hierarchical design planning to manage exploding pin counts. Learn how Siemens EDA's Innovator3D IC addresses these challenges.


Nanoscale SCE: Electrostatic Challenges and FinFET/GAA Mitigation Solutions

Nanoscale SCE: Electrostatic Challenges and FinFET/GAA Mitigation Solutions

Learn how scaling beyond Dennard's limits triggered short-channel effects (SCE) and why transitioning from FinFET to Gate-All-Around (GAA) architectures is vital for 2 nm control.