Industry White Paper
Overcoming the Challenges of Verifying Multi-Die Systems
June 12, 2024 by Synopsys
Topics Covered
- Motivation for Multi-Die Systems
- Challenges in Verifying Multi-Die Systems
- Effective Multi-Die System Verification
- The Synopsys Verification Solution for Multi-Die Systems
- Extension to Multiple Chips Simulation
White Paper Overview
Despite the clear advantages of multi-die designs, there are numerous new challenges that stand in the way of multi-die design realization. This white paper focuses on the verification challenges of multi-die designs, including addressing capacity and performance for system verification, validating assumptions made during architecture design, and knowing when verification is complete. Overcome such challenges with Synopsys' verification solutions for multi-die designs. The solutions provide the industry’s best way to verify functionality, CDC and RDC correctness, power intent, and inter-die connectivity.
