Effective Monitoring, Test, and Repair of Multi-Die Designs

White Paper Overview 

Despite the clear advantages of multi-die designs, there are numerous new challenges that stand in the way of multi-die design realization. This white paper focuses on the test challenges of multi-die designs for chiplets (pre-bond), interconnects (mid/post-bond), and multi-die stacks/packages (post pond). Overcome such challenges with Synopsys' comprehensive multi-die solutions for testing and repair of different types of die-to-die interfaces and lanes. The solutions test for and diagnose known-good stacks and known-good dies, support extensive BIST capabilities, and offer in-field interconnect monitoring for purposes such as predictive maintenance.