Early Architecture Performance and Power Analysis of Multi-Die Systems

White Paper Overview

Despite the clear advantages of multi-die designs, there are numerous new challenges that stand in the way of multi-die design realization. This white paper focuses on those challenges that can be addressed by early architecture exploration of multi-die designs, including system pathfinding, memory utilization and coherency, and power/thermal management. Platform Architect for Multi-Die helps optimize hardware-software partitioning, IP selection and configuration, interconnect and memory configuration, and power under consideration of the die-to-die interfaces. The solution includes a die-to-die model, including UCIe, as part of its library portfolio.